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ultralow noise microphone with bottom port and analog output data sheet admp504 rev. 0 information furnished by analog devices is believed to be accurate and reliable. however, no responsibility is assumed by analog devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. specifications subject to change without notice. no license is granted by implication or otherwise under any patent or patent rights of analog devices. trademarks and registered trademarks are the property of their respective owners. one technology way, p.o. box 9106, norwood, ma 02062-9106, u.s.a. tel: 781.329.4700 www.analog.com fax: 781.461.3113 ?2011 analog devices, inc. all rights reserved. features tiny, 3.35 mm 2.5 mm 0.88 mm surface-mount package omnidirectional response very high snr of 65 dba sensitivity of ?38 dbv extended frequency response from 100 hz to 20 khz low current consumption: 180 a single-ended analog output 120 db maximum spl high psr of 70 dbv compatible with sn/pb and pb-free solder processes rohs/weee compliant applications smartphones and feature phones tablet computers teleconferencing systems digital still and video cameras bluetooth headsets notebook pcs security and surveillance functional block diagram output amplifier admp504 power 10140-001 v dd gnd output figure 1. top iso bottom iso 10140-011 figure 2. isometric views of admp504 microphone package general description the admp504 1 is a high performance, very low noise, low power, analog output, bottom-ported omnidirectional mems microphone. the admp504 consists of a mems microphone element, an impedance converter and an output amplifier. the admp504 sensitivity specification makes it an excellent choice for both near field and far field applications. the admp504 is function- and pin-compatible with the admp404 microphone, providing an easy upgrade path. the admp504 has very high snr and extended wideband frequency response, resulting in natural sound with high intelligibility. low current consumption enables long battery life for portable applications. a built-in particle filter provides high reliability. the admp504 complies with the tia-920 telecommunications telephone terminal equipment transmis- sion requirements for wideband digital wireline telephones standard. the admp504 is available in an ultraminiature 3.35 mm 2.5 mm 0.88 mm surface-mount package. it is reflow solder compatible with no sensitivity degradation. the admp504 is halide free. 1 protected by u.s. patents 7,449,356; 7,825,484; 7,885,423; 7,961,897. other patents are pending.
admp504 data sheet rev. 0 | page 2 of 12 table of contents features .............................................................................................. 1 applications ....................................................................................... 1 functional block diagram .............................................................. 1 general description ......................................................................... 1 revision history ............................................................................... 2 specifications ..................................................................................... 3 absolute maximum ratings ............................................................ 4 esd caution .................................................................................. 4 pin configuration and function descriptions ............................. 5 typical performance characteristics ............................................. 6 applications information ................................................................ 7 supporting documents ................................................................7 handling instructions .......................................................................8 pick-and-place equipment ..........................................................8 reflow solder .................................................................................8 board wash ....................................................................................8 pcb land pattern layout .................................................................9 reliability specifications ................................................................ 10 outline dimensions ....................................................................... 11 ordering guide .......................................................................... 11 revision history 10/11revision 0: initial version
data sheet admp504 rev. 0 | page 3 of 12 specifications t a = 25c, v dd = 1.8 v , unless otherwise noted. all minimum and maximum specifications are guaranteed. typical specifications are not guaranteed. table 1 . parameter symbol test conditions /comments min typ max unit performance directionality omni sensitivity 1 khz, 94 db spl ? 41 ?38 ?35 dbv signal -to - noise ratio snr 20 hz to 20 khz, a - weighted 65 dba equivalent input noise ein 20 hz to 20 khz, a - weig hted 29 dba spl dynamic range derived from ein and m aximum a coustic i nput 9 1 db frequency response 1 low frequency ? 3 db point 100 hz high frequency ? 3 db point > 20 khz total harmonic distortion thd 10 4 db spl 3 % power supply reject ion ps r 217 hz, 100 mv p- p square wave superimposed on v dd = 1.8 v 70 db v max imum acoustic input peak , 10% thd 120 db spl power supply supply voltage v dd 1. 6 3. 3 v supply current i s v dd = 1.8 v 180 200 a v dd = 3.3 v 200 225 a out put characteristics output impedance z out 200 output dc offset 0.8 v output current limit 90 a maximum output voltage 120 db spl input , peak 0.25 v noise floor 20 hz to 20 khz, a - weighted , rms ? 103 dbv 1 see figure 5 and figure 7 .
admp504 data sheet rev. 0 | page 4 of 12 absolute maximum ratings table 2. parameter rating supply voltage ?0.3 v to +3.6 v sound pressure level (spl) 160 db mechanical shock 10,000 g vibration per mil-std-883 method 2007, test condition b temperature range ?40c to +85c stresses above those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. esd caution 10140-002 t p t l t 25c to peak t s preheat critical zone t l to t p tempe r a ture time ramp-down ramp-up t smin t smax t p t l figure 3. recommended soldering profile limits table 3. recommended soldering profile limits profile feature sn63/pb37 pb-free average ramp rate (t l to t p ) 1.25c/sec maximum 1.25c/sec maximum preheat minimum temperature (t smin ) 100c 150c maximum temperature (t smax ) 150c 200c time (t smin to t smax ), t s 60 sec to 75 sec 60 sec to 75 sec ramp-up rate (t smax to t l ) 1.25c/sec 1.25c/sec time maintained above liquidous (t l ) 45 sec to 75 sec ~50 sec liquidous temperature (t l ) 183c 217c peak temperature (t p ) 215c + 3c/?3c 260c + 0c/?5c time within 5c of actual peak temperature (t p ) 20 sec to 30 sec 20 sec to 30 sec ramp-down rate 3c/sec maximum 3c/sec maximum time 25c to peak temperature 5 minutes maximum 5 minutes maximum
data sheet admp504 rev. 0 | page 5 of 12 pin configuration and fu nction descriptions gnd output top view (terminal side down) not to scale admp504 1 v dd 3 2 10140-003 figure 4. pin configuration table 4. pin function descriptions pin no. mnemonic description 1 output analog output signal 2 gnd ground 3 v dd power supply
admp504 data sheet rev. 0 | page 6 of 12 typical performance character istics ?10 ?8 ?6 ?4 ?2 0 2 4 6 8 10 100 10k 1k frequency (hz) sensitivity (db) 10140-004 figure 5. frequency response mask 0 ?80 100 10k frequency (hz) psr (db) 1k ?10 ?20 ?30 ?40 ?50 ?60 ?70 10140-005 figure 6. typical power supply rejection vs. frequency 10 ?20 20 frequency (hz) sensitivity (db) 100 1k 10k 0 5 ?10 ?5 ?15 10140-006 figure 7. typical frequency response (measured)
data sheet admp504 rev. 0 | page 7 of 12 applications infor mation the admp504 output can be connected to a dedicated codec microphone input (see figure 8 ) or to a high input impedance gain stage (see figure 9 ). a 0.1 f ceramic capacitor placed close to the admp504 supply pin is used for testing and is recom - mended to adequately decouple the microphone from noise on the power supply. a dc - blocking capacitor is required at the output of the microphone. this capacitor create s a high -pass filter with a corner frequency at f c = 1/(2 c r ) where r is the codecs input impedance. a minimum value of 2.2 f is recommended in figure 8 because the inpu t impedance of the adau1361 / adau1761 can be as low as 2 k at its highest pga gain setting, which would result in a high - pass filt er corner frequency at about 37 hz. figure 9 shows the admp504 connected to an ada4897 -1 op amp c onfigured as a noninverting pre amp lifier . 10140 -0 07 adau 176 1 or adau 136 1 ad mp504 gnd output li nn li np mi cb ias cm 2.2f minimum 0.1f v dd figure 8. admp504 connected to the analog devices adau1761 or adau1361 codec 10140 -0 08 gain = (r1 + r2)/r1 admp504 gnd output 1f minimum 0.1f 10k ? r1 r2 v dd v ref v out v ref ada4897-1 figure 9. admp504 connected to the ada4897 -1 op amp supporting documents evaluation board user guide ug - 325 , e va l- admp504 - fl ex: bottom - ported analog output mems microphone evaluation board circuit note cn - 0207, high performance imems analog microphones simple interface to sigmadsp audio codec application notes an - 1003, recommendations for mounting and connecting analog devices, inc., bottom - ported mems microphones an - 1068, reflow soldering of the mems microphone an - 1112, microphone specifications explained an - 1124, recommendations for sealing analog devices, inc., bottom - port mems microphones from dust and liquid ingress
admp504 data sheet rev. 0 | page 8 of 12 handling instruction s pick -a nd - place equipment the mems microphone can be handled using standard pick - and - place and chip shoot ing equipment. take c are to avoid damage to the mems microphone structure as follows: ? use a standard pickup tool to handle the microphone. because the microph one hole is on the bottom of the package, the pickup tool can make contact with any part of the lid surface. ? use care during pick - and - place to ens ure that no high shock events above 10 k g are experienced because this may cause damage to the microphone. ? do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. do not pull air out or blow air into the microphone port. ? do not use excessive force to place the microphone on the pcb . reflow solder for best res ults, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used to attach the mems microphone to the pcb . it is recommended that the solder reflow profile not exceed the limit conditions specified in figure 3 an d table 3 . the admp504 has moisture sensitivity level (msl) class 3a. board wash when washing the pcb, ensure that water does not make contact with the microphone port. blow - off procedures and ultrasonic cleaning must not be used.
data sheet admp504 rev. 0 | page 9 of 12 pcb land pattern layout the recommended pcb land pattern for the admp504 should be laid out to a 1:1 ratio to the sold er pads on the micro phone package , as shown in figure 10 . take c are to avoid applying solder paste to the sound hole in the pcb. a suggested solder paste stencil pattern layout is shown in figure 11 . the diameter of the sound hole in the pcb should be larger than the diameter of the sound port of the microphone. a minimum diameter of 0.5 mm is recommended. 10140-009 ?1.55 ?0.95 1.52 0.90 1.90 1.22 0.68 0.61 0.61 figure 10 . pcb land pattern layout 10140-010 1.22 2 0.8 0.6 0.2 45 typ 1.52mm 1.55/1.05 dia. 0.225 cut width (2) figure 11 . suggested solder paste stencil pattern layout
admp504 data sheet rev. 0 | page 10 of 12 reliability specific ations the microphone sensitivity after stress must deviate by no more than 3 db from the initial value. table 5 . stress test description low temperature opera ting life ? 40c, 1000 hrs, powered high temperature operating life + 125c, 1000 hrs, powered temperature humidity bias ( thb ) +8 5c/ + 85% relative humidity (rh), 1000 hrs, powered temperature cycle ? 40c/+125c, one cycle per hour, 1 0 00 cycles high temperature sto rage + 150c, 1000 hrs low temperature storage ? 40c, 1000 hrs component cdm esd all pins, 0.5 kv component hbm esd all pins, 1.5 kv component mm esd all pins, 0.2 kv
data sheet admp504 rev. 0 | page 11 of 12 outline dimensions 2.575 2.500 2.425 3.425 3.350 3.275 06-16-2010-a top view side view r e f e r e n c e c o r n e r 0.98 0.88 0.78 0.21 ref 2.21 ref 3.06 ref 0.65 ref bottom view 1.08 0.95 dia. 0.25 nom 0.20 min dia. thru hole (sound port) 1.22 bsc 1.25 0.54 ref 0.64 ref 1.56 dia. 1.52 0.75 ref 0.30 bsc 1 3 2 0 . 9 0 0 . 6 8 ( p i n s 1 , 3 ) 0 . 2 0 t y p 4 5 0.30 bsc p i n 1 figure 12. 3-terminal chip array small outline no lead cavity [lga_cav] 3.35 mm 2.50 mm body (ce-3-2) dimensions shown in millimeters ordering guide model 1 temperature range package description package option 2 ordering quantity ADMP504ACEZ-RL ?40c to +85c 3-terminal lga_cav, 13 tape and reel ce-3-2 10,000 ADMP504ACEZ-RL7 ?40c to +85c 3-terminal lga_cav, 7 tape and reel ce-3-2 1,000 eval-admp504z-flex flex evaluation board 1 z = rohs compliant part. 2 this package option is halide free.
admp504 data sheet rev. 0 | page 12 of 12 notes ? 2011 analog devices, inc. all rights reserved. trademarks and registered trademarks are the property of their respective owners. d10140 -0- 10/11(0)

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